Member Area - Confidential Content

Milestones and Current State, Ordered by Delivery Date

order by work package


Status levels: finished in progress due critical

Milestone WP Partner Delivery
Nr. Title Mnth Date
MS44 Dissemination of activities in the project's web site and continuous update 7 KIT 1 11/2011
MS45 Press release on start of project to the public distributed 7 AIT 2 12/2011
MS1 Definition of chip-to-chip interconnection system environment and specification 2 AIT 3 01/2012
MS2 Definition of plasmonic devices and material properties for chip-to-chip interconnection 2 AIT 6 04/2012
MS8 Decision on an optimized structure for metallic/plasmonic nano-laser and its coupling to Si waveguide 3 TU/e 6 04/2012
MS9 Decision on an optimized structure for plasmonic modulator 3 KIT 6 04/2012
MS25 Decision on optimized plasmonic waveguide couplers 5 KIT 6 04/2012
MS10 Grown wafer structure for plasmonic lasers 3 IMEC 12 10/2012
MS16 Decision on optimized structures for plasmonic amplifiers 4 UVEG 12 10/2012
MS17 Synthesis of nanoparticles with gain at 1550nm 4 Ugent 12 10/2012
MS26 Fabrication of plasmonic waveguide couplers with less than 3 dB coupling loss 5 KIT 12 10/2012
MS27 Design of first generation beam shapers and compact optical filters 5 IMEC 12 10/2012
MS28 DDCM with electrical PHY design and verification 5 ST 12 10/2012
MS37 Plasmonic active device characterization results 6 KIT 12 10/2012
MS11 Fabrication of plasmonic modulator on a SOI platform 3 KIT 15 01/2013
MS18 Demonstration of conductive QD layers with photoconductive properties 4 UVEG 15 01/2013
MS19 Demonstration of metal-(lithographic) polymer and QD metal-(lithographic) polymer nanocompo-sites 4 UVEG 15 01/2013
MS29 Data codecs for power consumption reduction 5 ST 15 01/2013
MS30 Decision on plasmonic waveguide couplers with less than 3 dB coupling loss 5 KIT 15 01/2013
MS46 Identification of possible contributions to the industrial partners for commercialization 7 ST 15 01/2013
MS3 Development of a system and device simulation platform 2 AIT 18 04/2013
MS4 Definition of the interconnection level specification employing developed plasmonic photonic devices 2 ST 18 04/2013
MS12 Decision on an optimized structure for plasmonic modulator with a maximum loss of 20dB 3 KIT 18 04/2013
MS13* Initial characterization of unbonded plasmonic lasers 3 TU/e 18 04/2013
MS20 Demonstration and decision on photodetector operation: nano-gap (MIM) vs. Schottky / heterostructure 4 UVEG 18 04/2013
MS21 Electroluminescence from QD stack embedded within conductive oxides (>1µW) 4 IMEC 18 04/2013
MS31 Fabrication of compact optical filters and first generation beam shapers 5 IMEC 18 04/2013
MS32 Data codecs for error detection and correction 5 ST 18 04/2013
MS5 Digital domain to plasmonic domain interface specification and VHDL modelling 2 ST 21 07/2013
MS14 Initial testing and characterization of plasmonic modulators 3 KIT 21 07/2013
MS22 Demonstration of plasmonic amplifiers with optical pumping exhibiting 10dB gain Appendix A 4 IMEC 21 07/2013
MS6 Plasmonic interconnect VHDL modeling 2 ST 24 10/2013
MS15 Initial testing of bonded plasmonic lasers 3 TU/e 24 10/2013
MS23 Operation of QD based photodetector with responsivity > 0.1A/W 4 UVEG 24 10/2013
MS33 Design of second generation beam shapers 5 IMEC 24 10/2013
MS34 Generic DDCM compatible with plasmonic-based PHY 5 ST 24 10/2013
MS38 Plasmonic passive components characterization results with a 1dB coupling loss 6 KIT 24 10/2013
MS47 Organization of workshop on silicon photonics interface for chip-to-chip communication 7 TU/e 34 08/2014
MS35 Fabrication of compact optical filters and first generation beam shapers 5 IMEC 39 01/2015
MS36** DDCM evolution for NiP solutions 5 ST 39 01/2015
MS40 Individual plasmonic devices characterization, testing and evaluation 6 TU/e 39 01/2015
MS39 Concept for system integration developed 6 AIT 40 02/2015
MS50 Final planning of system demonstrator 6 AIT/ETH 41 03/2015
MS51 Report on enhanced metal grating couplers 7 TU/e 41 03/2015
MS41 Chip to chip interconnect characterization 6 ST/ETH 42 04/2015
MS42 Plasmonic components integration to demonstrate chip-to-chip interconnect 6 AIT 42 04/2015
MS7 Investigation of the cost and power consumption efficiency of the developed plasmonic devices 2 AIT 45 07/2015
MS24 Demonstration of SPP amplifiers with electrical injection exhibiting 10dB/cm gain 4 UVEG 45 07/2015
MS43 Plasmonic chip to chip interconnect prototype testing and evaluation 6 ST/ETH 45 07/2015
MS48 Public web site for NAVOLCHI prepared to stay open for at least another year 7 KIT 45 07/2015
MS49 Press release distributed comprising key results with a public target audience 7 AIT 45 07/2015

*: MS13 has been identified as inappropriate to the course of the project and was skipped in agreement with EC

**: MS36 has been skipped after the retreat of ST