Member Area - Confidential Content
Milestones and Current State, Ordered by Delivery Date
Status levels: | finished | in progress | due | critical |
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Milestone | WP | Partner | Delivery | |||
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Nr. | Title | Mnth | Date | |||
MS44 | Dissemination of activities in the project's web site and continuous update | 7 | KIT | 1 | 11/2011 | |
MS45 | Press release on start of project to the public distributed | 7 | AIT | 2 | 12/2011 | |
MS1 | Definition of chip-to-chip interconnection system environment and specification | 2 | AIT | 3 | 01/2012 | |
MS2 | Definition of plasmonic devices and material properties for chip-to-chip interconnection | 2 | AIT | 6 | 04/2012 | |
MS8 | Decision on an optimized structure for metallic/plasmonic nano-laser and its coupling to Si waveguide | 3 | TU/e | 6 | 04/2012 | |
MS9 | Decision on an optimized structure for plasmonic modulator | 3 | KIT | 6 | 04/2012 | |
MS25 | Decision on optimized plasmonic waveguide couplers | 5 | KIT | 6 | 04/2012 | |
MS10 | Grown wafer structure for plasmonic lasers | 3 | IMEC | 12 | 10/2012 | |
MS16 | Decision on optimized structures for plasmonic amplifiers | 4 | UVEG | 12 | 10/2012 | |
MS17 | Synthesis of nanoparticles with gain at 1550nm | 4 | Ugent | 12 | 10/2012 | |
MS26 | Fabrication of plasmonic waveguide couplers with less than 3 dB coupling loss | 5 | KIT | 12 | 10/2012 | |
MS27 | Design of first generation beam shapers and compact optical filters | 5 | IMEC | 12 | 10/2012 | |
MS28 | DDCM with electrical PHY design and verification | 5 | ST | 12 | 10/2012 | |
MS37 | Plasmonic active device characterization results | 6 | KIT | 12 | 10/2012 | |
MS11 | Fabrication of plasmonic modulator on a SOI platform | 3 | KIT | 15 | 01/2013 | |
MS18 | Demonstration of conductive QD layers with photoconductive properties | 4 | UVEG | 15 | 01/2013 | |
MS19 | Demonstration of metal-(lithographic) polymer and QD metal-(lithographic) polymer nanocompo-sites | 4 | UVEG | 15 | 01/2013 | |
MS29 | Data codecs for power consumption reduction | 5 | ST | 15 | 01/2013 | |
MS30 | Decision on plasmonic waveguide couplers with less than 3 dB coupling loss | 5 | KIT | 15 | 01/2013 | |
MS46 | Identification of possible contributions to the industrial partners for commercialization | 7 | ST | 15 | 01/2013 | |
MS3 | Development of a system and device simulation platform | 2 | AIT | 18 | 04/2013 | |
MS4 | Definition of the interconnection level specification employing developed plasmonic photonic devices | 2 | ST | 18 | 04/2013 | |
MS12 | Decision on an optimized structure for plasmonic modulator with a maximum loss of 20dB | 3 | KIT | 18 | 04/2013 | |
MS13* | Initial characterization of unbonded plasmonic lasers | 3 | TU/e | 18 | 04/2013 | |
MS20 | Demonstration and decision on photodetector operation: nano-gap (MIM) vs. Schottky / heterostructure | 4 | UVEG | 18 | 04/2013 | |
MS21 | Electroluminescence from QD stack embedded within conductive oxides (>1µW) | 4 | IMEC | 18 | 04/2013 | |
MS31 | Fabrication of compact optical filters and first generation beam shapers | 5 | IMEC | 18 | 04/2013 | |
MS32 | Data codecs for error detection and correction | 5 | ST | 18 | 04/2013 | |
MS5 | Digital domain to plasmonic domain interface specification and VHDL modelling | 2 | ST | 21 | 07/2013 | |
MS14 | Initial testing and characterization of plasmonic modulators | 3 | KIT | 21 | 07/2013 | |
MS22 | Demonstration of plasmonic amplifiers with optical pumping exhibiting 10dB gain Appendix A | 4 | IMEC | 21 | 07/2013 | |
MS6 | Plasmonic interconnect VHDL modeling | 2 | ST | 24 | 10/2013 | |
MS15 | Initial testing of bonded plasmonic lasers | 3 | TU/e | 24 | 10/2013 | |
MS23 | Operation of QD based photodetector with responsivity > 0.1A/W | 4 | UVEG | 24 | 10/2013 | |
MS33 | Design of second generation beam shapers | 5 | IMEC | 24 | 10/2013 | |
MS34 | Generic DDCM compatible with plasmonic-based PHY | 5 | ST | 24 | 10/2013 | |
MS38 | Plasmonic passive components characterization results with a 1dB coupling loss | 6 | KIT | 24 | 10/2013 | |
MS47 | Organization of workshop on silicon photonics interface for chip-to-chip communication | 7 | TU/e | 34 | 08/2014 | |
MS35 | Fabrication of compact optical filters and first generation beam shapers | 5 | IMEC | 39 | 01/2015 | |
MS36** | DDCM evolution for NiP solutions | 5 | ST | 39 | 01/2015 | |
MS40 | Individual plasmonic devices characterization, testing and evaluation | 6 | TU/e | 39 | 01/2015 | |
MS39 | Concept for system integration developed | 6 | AIT | 40 | 02/2015 | |
MS50 | Final planning of system demonstrator | 6 | AIT/ETH | 41 | 03/2015 | |
MS51 | Report on enhanced metal grating couplers | 7 | TU/e | 41 | 03/2015 | |
MS41 | Chip to chip interconnect characterization | 6 | ST/ETH | 42 | 04/2015 | |
MS42 | Plasmonic components integration to demonstrate chip-to-chip interconnect | 6 | AIT | 42 | 04/2015 | |
MS7 | Investigation of the cost and power consumption efficiency of the developed plasmonic devices | 2 | AIT | 45 | 07/2015 | |
MS24 | Demonstration of SPP amplifiers with electrical injection exhibiting 10dB/cm gain | 4 | UVEG | 45 | 07/2015 | |
MS43 | Plasmonic chip to chip interconnect prototype testing and evaluation | 6 | ST/ETH | 45 | 07/2015 | |
MS48 | Public web site for NAVOLCHI prepared to stay open for at least another year | 7 | KIT | 45 | 07/2015 | |
MS49 | Press release distributed comprising key results with a public target audience | 7 | AIT | 45 | 07/2015 |
*: MS13 has been identified as inappropriate to the course of the project and was skipped in agreement with EC
**: MS36 has been skipped after the retreat of ST